Vitreous Systems is a semiconductor capital equipment company serving the back-end advanced packaging and heterogeneous integration market. Vitreous is developing a first-of-its-kind, software-defined platform engineered for next generation, multi-modal interconnects—providing the industry with a reliable packaging solution for the critical transition from silicon to glass core substrates.

In the paradigm of legacy mechanical architectures, there is an ever-present tradeoff between speed an accuracy. Traditional assembly tools are either/or, but never both. As radical new package architectures arrive to drive performance requirements, this compromise no longer works. To deliver both high speed and high accuracy, a new class of tool is required.

Vitreous Systems delivers both without compromise. Our ultra-low-latency, software-defined architecture corrects for micro-warpage, thermal gradients, and material variances in real time, allowing device manufacturers to seamlessly scale their most complex architectures.